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1st Jun 2018, The Hive @NTU
52 Nanyang Avenue Singapore

To register, click here

AGENDA

TIME PROGRAM
0900 Registration
0930 Opening address – Tang Kien Mun, Teknor Apex Asia Pacific Pte Ltd
SPE ASEAN Committee President
0935 Words of welcome by NTU
Associate Professor Aravind Dasari
0945 Sodick V-Line Technology
Mr. Han Meng Shu, Sodick Singapore Pte Ltd
1015 Incroslip SL – A New Generation Of Long Lasting Slip, Anti-scratch, Low Odour And Oxidative Stability Additives
Christohper Goh, Croda Singapore Pte Ltd
1045 Tea Break
1100 Heat Seal And Oxygen Barrier Efficiency in Packaging
Ms. Geetha Arumugam, Michelman Asia-Pacific Pte Ltd
1130 Moldflow Material Modelling And Its Application In Moldability Analysis: A Case Study
Dr. Cheng Kuo Feng Henry, Singapore Institute of Manufacturing Technology A*Star
1200 Lunch
1330 Sponsors appreciation
1345 Innovation @ Covestro APAC: Shaping And Coloring The Future In Polycarbonate
Dr. Christopher Stillings, Covestro China LLC
1415 Recent Recycling Technology Challenges For Packaging Materials
Mr. Raymond Wong, NGR
1445 Tea Break
1500 Introduction to 3M™ Dynamar™ Polymer Processing Additives
Dr. Pan Yong Zheng, 3M Singapore
1530 Gravi-tech And Vibration Damping Technology
Mr. Koay Yee Farn, Polyone
1600 Industry Collaboration and Partnership by NTU
TBD
1630 Best Student Poster Award
1645 Seminar Ends